(1) Pre{1}}ajiya
Ayyukan pre{0} vacuum chamber shine tabbatar da cewa an kula da ɗakin da aka saita a matakin da aka saita, muhallin waje bai shafe shi ba (kamar ƙura, tururin ruwa), da keɓe iskar gas mai haɗari daga ɗaki mai tsabta. Ya ƙunshi murfi, injin sarrafa kwamfuta, injin watsawa, ƙofar keɓewa, da sauransu.
(2) Zauren fiddawa
Gidan etching shine ainihin tsarin kayan aikin ICP. Yana da tasiri kai tsaye akan ƙimar etching, madaidaiciyar etching, da rashin ƙarfi. Babban abubuwan da ke cikin ɗakin etching sune: na'urar lantarki ta sama, na'urar mitar rediyo ta ICP, na'urar mitar rediyo RF, tsarin ƙananan lantarki, tsarin kula da zafin jiki, da sauransu.
(3) Tsarin samar da iskar gas
Tsarin samar da iskar gas shine don isar da iskar gas iri-iri zuwa ɗakin etching, da kuma sarrafa daidaitaccen adadin iskar gas da gudana ta hanyar mai sarrafa matsa lamba (PC) da mai kula da kwararar ruwa (MFC). Tsarin samar da iskar gas ya ƙunshi kwalban iskar gas, bututun isar gas, tsarin sarrafawa, naúrar haɗawa, da dai sauransu.
(4) Tsarin Matsala
Akwai nau'ikan injina guda biyu, ɗaya don pre{0} vacuum chamber da ɗayan don ɗakin ɗaki. Wurin da aka rigaya - ana fitar da shi ta hanyar famfon inji. Sai kawai lokacin da matakin injin da ke cikin pre{4}}vacuum chamber ya kai ƙimar da aka saita za'a iya buɗe ƙofar keɓe don canja wurin wafer.